MIIVII EVO XAVIER
MIIVII EVO XAVIER
MIIVII EVO XAVIER
MIIVII EVO XAVIER

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MIIVII EVO XAVIER

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 Features

  • High performance passive cooling system

  • IP5X Protection

  • 4×Gigabit PoE+ Port, IEEE 802.3at protocol

  • Vibration resistance according to IEC 60068

  • -20℃-60℃ Operating temperature

  • Various I/O interface and expansion

 Specifications

 Processor


Specification
Processor NVIDIA Jetson AGX Xavier
AI Performance Up to 32T OPS
CPU 8-core ARM v8.2 64-bit CPU
GPU 512-core Volta GPU
Memory

32GB 256-Bit LPDDR41

DL Accelerator 2×NV DLA Engines
Storage 32GB eMMC 5.1
Video Encode

4x 4Kp60
8x 4Kp30
16x 1080p60
32x 1080p30
(H.265)

4x 4Kp60
8x 4Kp30
14x 1080p60
30x 1080p30
(H.264)

Video Decode

2x 8Kp30
6x 4Kp60
12x 4Kp30
26x 1080p60
52x 1080p30
(H.265)

4x 4Kp60
8x 4Kp30
16x 1080p60
32x 1080p30
(H.264)

1

Jetson AGX Xavier DRAM内存规格由16GB提升到32GB。

 

 I/O


Interface Quantity Note
Function KEY Power Button 1
Recovery Button 1
Network/Camera Ethernet 1×Gigabit Port
4×PoE+ Gigabit Port
IEEE 802.3 at PoE+ 25.5W
Video output HDMI 1×HDMI 2.0 TYPE A 5V 1A
USB USB 3×USB 3.1 gen1 TYPE A
1×USB 2.0 TYPE A
USB 5V, 1A
USB 2.0 Flashing Port
I/O UART 2xRS232
2xRS485
1xTTL
DB9 Terminal
TTL 3.3V for GPS Function
CAN 2 Two CAN in One DB9 Terminal
With CAN chip, terminal resistor 120Ω
GPIO 8xIsolated DI
8xIsolated DO
DI 3.3-50V DC
DO 5-40V DC
User Expansion TF Socket 1xTF Slot MicroSD card supported
M.2 1×M.2 M Key 2280 SIZE NVME SSD
Mini PCle 2
Nano SIM Socket 2 For Nano SIM Card


 Power Supply

Power Supply Spec
Input Type DC
Input Voltage Wide input 14-48V (Optional) 24-48V for PoE
Typical consumption 50W

 Mechanical

Mechanical Spec
Dimensions (W×H×D) 226mm×70mm×144.5mm (I/O ports and mounting holes excluded)
Weight 2.3Kg

 Environmental

Environmental Spec
Operating Temperature -20℃-60℃, 0.2~0.3m/s air flow2
Storage Temperature -25℃-80℃
Storage Humidity 10%-90% non-condensing
Vibration 5gn,10Hz~150Hz,3 Axis3
Protection IP5X
ESD Touch 4KV, Air 8KV
TVS 500V

 Certification

Certification Status
CCC, CE, FCC, RoHS, SRRC Processing


[1]  Jetson AGX Xavier DRAM内存规格由16GB提升到32GB。
[2]  According to GB/T 2423-2008 60℃以上运行时,运行频率降低 Working frequency is subject to change after temperature reaches 60℃
[3]  According to GB/T 2423.10-2008

 Install Dimension

Dimensions and mounting hole position as below:

 Up view(Unit:mm)

 Front view(Unit:mm)

 Left view(Unit:mm)

 Mounting Hole(Unit:mm)

 Mounting Hole(Unit:mm)